KochChemie Polishing & Sealing Pad

The KochChemie Polishing & Sealing Pad is an extra-fine finish sponge designed for economically and evenly applying sealing products. With a short height of 23mm, this pad creates low torsion forces, providing excellent handling and the highest level of stability. The optimized reticulation (open cellular structure) and cell count contribute to excellent hygiene factors, making it a safe and reliable choice for polishing.

The milling edge of this pad ensures extra flexibility, allowing it to fit around contours with ease. The colorful non-woven material used for polishing adds to the process safety, ensuring a smooth and efficient application. With a compression hardness of 4 and an abrasiveness level of 2, this pad is perfect for achieving a flawless finish on any surface.